Advantech TPC-B510-873BE, Intel Core i7-8665UE, 8GB DDR4 Computing Box Module
When an industrial system needs compact computing power but has limited space and cannot rely on a conventional desktop computer, a dedicated computing box module can provide a more practical solution. The system also needs to handle continuous operation, industrial connectivity, and installation in different equipment or control-panel environments.
The Advantech TPC-B510-873BE is a compact computing box module built around an 8th Gen Intel Core i7-8665UE quad-core processor running at 1.70GHz. It combines processing, memory, networking, storage expansion, and industrial I/O in a single fanless platform. This design helps provide computing capability for industrial systems without requiring a separate conventional PC chassis.
The built-in 8GB DDR4 SO-DIMM provides system memory, while the storage interfaces support different configurations using M.2 SATA or NVMe PCIe storage, an additional M.2 SATA interface, and a 2.5" SATA SSD or HDD. The module also includes a full-size mini PCIe slot and SIM card slot, providing options for system expansion and cellular connectivity when supported modules are installed.
For industrial communication, the TPC-B510-873BE provides both 1GbE and 2.5GbE networking along with RS-232/422/485 serial interfaces. Four USB 3.1 Gen.2 ports, a USB 2.0 port, DisplayPort, audio connectivity, and an iDoor slot provide additional interfaces for peripherals, displays, and application-specific expansion. TPM 2.0 also provides built-in hardware security support.
The fanless design helps avoid the use of a mechanical cooling fan, making the module suitable for applications where reduced moving parts are useful. Its die-cast aluminum alloy back housing, IP66-rated front panel, 24 VDC input, and operating temperature range of -10~55°C support installation in industrial environments. With VESA, desktop, wall, or panel mounting options, it can be integrated into different machine, automation, control, and industrial computing systems.
Key features
- 8th Gen. Intel Core i7-8665UE 1.70GHz quad-core processor
- 1 x 8G DDR4 SO-DIMM built-in
- Fanless design
- 1 x 1GbE and 1 x 2.5GbE
- M.2, 2.5" SSD/HDD, mini PCIe and SIM card expansion
- 2 x RS-232/422/485 and multiple USB interfaces
- TPM 2.0 (built-in)
- IP66-rated front panel
Specifications
| General |
|
| BIOS |
AMI UEFI |
| Certification |
BSMI, CCC, CE, FCC Class A, CB/UL |
| Cooling System |
Fanless design |
| Dimensions (W x H x D) |
268.96 x 202.96 x 39.5 (mm) |
| Enclosure |
Back housing: Die cast aluminum alloy |
| Mounting |
VESA Mount, Desktop, Wall or Panel Mount |
| OS Support |
Win 10, Android, Linux |
| Security |
TPM 2.0 (built-in) |
| Power Consumption |
Typ. 29W; Max. 65W |
| Power Input |
24 VDC ± 20% |
| Watchdog Timer |
15-255 sec (system) |
| Weight (Net) |
4.5kg |
| System Hardware |
|
| CPU |
8th Gen. Intel® Core™ i7-8665UE 1.70GHz Quad-core processor |
| Memory |
Dual channel DDR4 SO-DIMM (Each channel supports up to 16G)
1 x 8G DDR4 SO-DIMM (Built-in) |
| LAN |
1 x 1GbE and 1 x 2.5GbE |
| Expansion Slot |
1 x Full-size mini PCIe
1 x SIM card slot |
| Storage Slot |
1 x M.2 M key 2280 (SATA*or NVMe PClex4)
1 x M.2 B Key 2242 (SATA)*
3042, 3052 (PCIe/USB3.0 for 4G/5G module)
1 x 2.5" SSD/ HDD (SATA, Max. 7mm) |
| I/O |
2 x RS-232/422/485
1 x USB 2.0
4 x USB 3.1 (Gen.2)
1 x iDoor slot
1 x Displayport (Video output)
1 x Audio line out/ mic in |
| Environment |
|
| Humidity |
95% RH @ 40°C, non-condensing |
| Ingress Protection |
IP66-rated front panel |
| Operating Temperature |
-10~55°C (14~131°F) (w/o air flow) |
| Storage Temperature |
-20~70°C (-4~158°F) |
| Vibration Protection |
With SSD: 1 Grms (5 ~ 500 Hz) (Operating, random vibration) |
