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Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling
Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling
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Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling

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Product Code: CFHO-536

MPN #: AK-455-1.5G

Unlock the full potential of your PC with the Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling – the secret weapon that keeps your processor running cool and fast. This premium thermal compound delivers exceptional heat transfer, helping you achieve higher overclocking scores and quieter operation.

Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling

Designed for serious builders, the AK-455 offers a thermal conductivity of 2.4 W/m·K and a low thermal impedance of less than 0.087 °C·cm²/W. Its non‑curing, non‑conductive formula ensures safe application on CPUs, GPUs, and chipset heatsinks without risking short circuits.

The syringe packaging provides precise, mess‑free dispensing, while the 0.87 ml volume (1.5 g) is enough for multiple installations. With an operating temperature range from –50 °C to +240 °C, this paste remains stable under extreme loads and long gaming sessions.

RoHS‑compliant and OEM‑ready, the AK-455 is a reliable choice for both DIY enthusiasts and professional technicians who demand consistent performance and easy handling.

Benefits

  • Superior heat transfer reduces CPU temperatures and improves stability.
  • Non‑conductive formula protects against accidental short circuits.
  • Wide operating temperature range ensures reliability under heavy loads.
  • Syringe applicator delivers precise, mess‑free application every time.

Uses of the product

  • Applying between CPU and stock or aftermarket coolers.
  • Thermal interface for GPU heat sinks and graphics cards.
  • Improving heat dissipation on chipset and VRM coolers.
  • Upgrading thermal performance in workstation and gaming rigs.

Features

  • Thermal conductivity of 2.4 W/m·K for efficient heat flow.
  • Viscosity of ~76 mPa·s provides easy spread without excess.
  • Density of ~2.5 g/cm³ and 0.87 ml volume for multiple uses.
  • Non‑curing, non‑conductive composition with RoHS compliance.

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