Unlock the full potential of your PC with Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling – the secret weapon that lets you push your hardware harder while keeping temperatures low.
Akasa AK-455 1.5g High-Performance Thermal Paste Compound Syringe forCPU Cooling
This thermal compound delivers a high thermal conductivity of 2.4 W/m·K and a thermal impedance below 0.087 °C·cm²/W, ensuring rapid heat transfer from your processor to the cooler. It stays stable from –50 °C to +240 °C, so you can trust it under extreme loads and overclocking sessions.
The non‑curing, non‑conductive formula protects your components from accidental short‑circuits, while its viscosity of ~76 mPa·s makes it easy to spread evenly. The 0.87 ml syringe provides precise application without mess, and the OEM package keeps the cost low.
Designed for CPUs, GPUs, chipsets and VRM heatsinks, this RoHS‑compliant paste works with a wide range of cooling solutions, giving you reliable performance for years to come.
Benefits
- Significantly lowers processor and GPU temperatures for better performance.
- Enables higher stable overclocking margins without thermal throttling.
- Extends the lifespan of your components by reducing heat‑related wear.
- Provides a non‑conductive, safe solution that protects against short circuits.
Uses of the product
- Applying between CPU and its heatsink for optimal cooling.
- Enhancing heat transfer on GPU cooling blocks.
- Improving thermal contact on chipset and VRM heatsinks.
- Upgrading legacy systems with modern, high‑efficiency paste.
Features
- Thermal conductivity of 2.4 W/m·K for rapid heat dissipation.
- Low thermal impedance (< 0.087 °C·cm²/W) ensures efficient heat flow.
- Non‑curing, non‑conductive formula with RoHS compliance for safety.
- Syringe applicator (0.87 ml, 1.5 g) provides precise, mess‑free application.
| Specification |
Details |
| Brand |
Akasa |
| Model |
AK-455 |
| Part Number |
AK-455-1.5G |
| Product Type |
Thermal Paste / Thermal Compound |
| Category |
Thermal Paste |
| Color |
Grey |
| Thermal Conductivity |
2.4 W/m·K |
| Volume |
0.87 ml |
| Net Weight |
1.5 g |
| Form |
Non-curing thermal compound |
| Density |
~2.5 g/cm³ |
| Thermal Impedance |
< 0.087 °C·cm²/W |
| Viscosity |
~76 mPa·s |
| Operating Temperature |
−50 °C to +240 °C |
| Electrical Conductivity |
Non-conductive |
| Application Method |
Syringe |
| Package Type |
OEM (no spreader, no manual) |
| Compatibility |
CPU, GPU, chipset heatsinks |
| Compliance |
RoHS compliant |
| Intended Use |
Improves heat transfer between processor and h |
