Banana Pi BPI-SM10 (K3-CoM260) 8+128G RISC-V AI CPU SpacemiT Developer Kit
Turn Your RISC-V Edge-AI Agent Ideas Into Reality
The SpacemiT K3-CoM260 delivers up to 60 TOPS of general-purpose AI compute and can smoothly run 30-billion-parameter (30B) large models, such as the 30B-A3B series. It offers a highly accessible, user-friendly development environment for developers, students, and makers.
The developer kit includes a K3-CoM260 core module and a universal reference carrier board. The carrier board is fully compatible with the K3-CoM260 series and provides ready-to-use demos for edge AI agent development.
The K3-CoM260 module integrates 8x 100T™ general-purpose CPU cores and 8x A100™ AI CPU cores, delivering 130 KDMIPS of general compute and 60 TOPS of general AI compute. Real-world testing shows inference performance greater than 10 Tokens/s@ 30B. It supports multi-pipeline concurrent AI workloads and high-performance inference tasks. The included carrier board offers a wide range of I/O interfaces while remaining hardware-compatible with NVIDIA Jetson Orin Nano, simplifying hardware migration.
Key Features
- SpacemiT K3 RISC-V AI CPU with 8 × X100 cores at 2.4 GHz.
- 8 × A100 AI cores delivering 60 TOPS for deep-learning workloads.
- Integrated 3D GPU supporting Vulkan, OpenCL and OpenGL ES.
- Memory speed of 6400 MT/s for fast data access.
- Supports internal UFS, SD card, and external NVMe storage.
- 4K60 video encoding (H.264/H.265) and multi-stream 4K/1080p decoding.
- Power consumption between 18W–35W
NOTE:
Memory Configuration:
Default: 8GB + 128GB
Optional: 16GB + 128GB and 32GB + 128GB
Specifications
| Chip |
SpacemiT K3 RISC-V AI CPU |
| CPU |
8 × X100™ 64-bit RISC-V CPU cores, 2.4 GHz.
2 clusters × 4 cores per cluster, each cluster includes 4 MB shared L2 cache, with cross-cluster access.
Each X100 core includes 64 KB I-cache and 64 KB D-cache.
Compliant with the RVA23 profile.
Supports RVV 1.0, VLEN: 256 bits. |
| AI Performance |
8 × A100™ AI CPU cores, delivering 60 TOPS.
2 clusters × 4 cores per cluster, each cluster includes 1 MB shared L2 cache and 1.5 MB TCM (Tightly Coupled Memory), with cross-cluster access.
Each A100 core includes 32 KB I-cache and 32 KB D-cache.
Supports RVV 1.0, VLEN: 1024 bits. |
| GPU |
Integrated 3D GPU, with support for Vulkan, OpenCL, and OpenGL ES |
| Memory Speed |
6400MT/s |
| Memory Capacity |
Default : 8+128G
Optional: 32+128G , 16+128G
|
| Storage |
Supports internal UFS, SD card, and external NVMe |
| Video Encoding |
4K60 (H.264/H.265) |
| Video Decoding |
1 × 4K120 (H.264/H.265/VP9)
2 × 4K60 (H.264/H.265/VP9)
8 × 1080p60 (H.264/H.265/VP9)
16 × 1080p30 (H.264/H.265/VP9) |
| Power Consumption |
18W–35W |
Reference Carrier Board
| Camera |
2 × MIPI CSI-2, 22-pin camera connectors |
| PCIe |
M.2 Key M slot (PCIe Gen 3 × 4)
M.2 Key M slot (PCIe Gen 3 × 1)
M.2 Key E slot |
| USB |
4 × USB 3.0 Type-A
1 × USB Type-C (UFP device mode supported) |
| Networking |
1 × GbE connector |
| Display |
1 × DP 1.2 connector
1 × MIPI DSI-1.2 30-pin display connector |
| Other I/O |
40-pin expansion header (UART, SPI, I2S, I2C, GPIO)
12-pin button header
4-pin fan header
DC power jack |
