Looking for a board that can survive harsh factories and still run smart AI tasks? The Congatec conga-SMX95/i-MX959-6C-8G eMMC64 is a rugged SMARC 2.2 module built for industrial machines, edge gateways and vision systems. It solves the pain of frequent crashes, slow performance and limited connectivity in tough environments. With this module you get the power you need without the downtime you fear.
Congatec conga-SMX95/i-MX959-6C-8G eMMC64, Industrial-grade SMARC 2.2 CoM
Many industrial projects struggle with processors that cannot handle AI inference and real-time control at the same time. When a device lags, production stops and costs rise. This module brings a six-core NXP i.MX 959 processor, an on-board NPU delivering up to 2 TOPS, and 8 GB of LPDDR5 memory. The result is fast AI, smooth multitasking and reliable operation even in temperatures from -40 C to +85 C. You get a clear, single solution that fits into any SMARC carrier board.
Key Features
- NXP i.MX 959 6-core processor with Cortex-A55, Cortex-M7 and Cortex-M33.
- eIQ Neutron NPU delivering up to 2 TOPS for AI inference.
- 8 GB LPDDR5 RAM and 64 GB eMMC storage on board.
- 2 Gigabit Ethernet with TSN and IEEE 1588 support.
- Optional M.2 1216 Wi-Fi 6 / Bluetooth 5.3 module.
- USB: 1 x dual-role 2.0, 2 x USB 2.0, 2 x USB 3.0.
- Up to 2 MIPI-CSI 4-lane camera interfaces with ISP for up to 12 MP.
- Display: dual-channel LVDS and HDMI 2.0a via MIPI-DSI bridge.
- Audio: up to 2 IS, HiFi 4 DSP for clear sound.
- CAN FD 2, UART 3, 14 GPIO for industrial I/O.
Specifications
| Processor |
|
| Processor |
NXP i.MX 9596 6-core processor |
| CPU |
6× ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33 |
| AI Processor |
NXP eIQ® Neutron NPU, Up to 2 TOPS |
| Memory |
|
| DRAM |
8GB onboard LPDDR5 memory |
| eMMC |
64GB onboard eMMC |
| Networking |
|
| Ethernet |
2× Gigabit Ethernet with support for TSN, IEEE 1588 |
| Wireless (Optional) |
Soldered M.2 1216 WiFi 6 / Bluetooth 5.3 |
| I/O Interfaces |
|
| USB |
1× Dual-role USB 2.0, 2× USB 2.0, 2× USB 3.0 |
| SDIO |
1× SDIO 3.0 |
| PCIe |
2× PCIe 3.0 x1 |
| I²C |
2× I²C |
| SPI |
1× SPI |
| QSPI |
1× QSPI |
| UART |
Up to 3× UART (2× with Handshake) |
| CAN |
Up to 2× CAN FD |
| GPIO |
14× GPIO |
| Storage |
|
| Mass Storage |
eMMC 5.1 up to 256 GByte |
| Graphics |
|
| GPU |
Integrated in SoC, Arm® Mali™ G310 3D GPU |
| Graphics Features |
2D GPU supporting blend graphics overlays, OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0 |
| Video Interfaces |
|
| Display Interfaces |
1× Dual-channel 24-bit LVDS, 1× HDMI 2.0a through MIPI-DSI to HDMI bridge (shared with MIPI-DSI),
|
| Camera Interfaces |
Up to 2× MIPI-CSI 4-lanes, 2× Integrated Image Signal Processor (ISP) for cameras
up to 12 MP resolution (on selected processor SKUs)
|
| Audio |
|
| Audio |
Up to 2× I²S, HiFi 4 DSP |
| Features |
|
| System Features |
Watchdog Timer, Cortex-M7 and Cortex-M33 console, Optional JTAG debug interface,
High-precision Real Time Clock
|
| AI & Machine Learning |
|
| AI & ML |
NXP eIQ® Neutron Neural Processing Unit (NPU) with up to 2 TOPS,
NXP eIQ® ML Software Development Environment
|
| Power |
|
| Power Consumption |
Low power Cortex-A55 / Cortex-M33 / Cortex-M7, Typical application 3–8W
@ 5V
|
| Environmental |
|
| Operating Temperature |
-40°C to +85°C |
| Storage Temperature |
-40°C to +85°C |
| Operating Humidity |
10% to 85% RH, Non-condensing |
| Storage Humidity |
5% to 85% RH, Non-condensing |
| Mechanical |
|
| Form Factor |
SMARC Module |
| Dimensions |
82 × 50 mm (3.23 × 1.97 in) |
