Tired of slow, unreliable boards that cant keep up with AI vision tasks? The Congatec conga-STDA4/i-TDA4VM-4G eMMC32 is a rugged SMARC computer-on-module designed for industrial machines that need fast processing, real-time networking and long-term temperature stability. If your system stalls when handling multiple cameras or heavy data streams, you need a module that delivers high performance in a tiny, hardened package.
Congatec conga-STDA4/i-TDA4VM-4G eMMC32, Industrial SMARC Computer-on-Module COM
Manufacturers often struggle with a lack of compute power in a size that fits tight enclosures. This problem becomes critical when you add AI inference, multiple video inputs and strict timing requirements. The Congatec module solves it by packing a TI TDA4VM processor, 4 GB LPDDR4, 32 GB eMMC and dual 1 GbE ports into an 82 50 mm board that operates from -40 C to +85 C. You get the processing muscle, storage and connectivity you need without redesigning the whole carrier board.
Key Features
- TI TDA4VM Arm Application Processor with dual Cortex-A72 @ 2 GHz.
- Six Cortex-R5F cores for real-time control tasks.
- Deep-learning Matrix Multiply Accelerator delivering up to 8 TOPS.
- Integrated PowerVR Rogue 8XE GPU supporting up to four concurrent displays.
- Dual 1 GbE ports with IEEE 1588 time synchronization.
- 4 GB LPDDR4 and 32 GB eMMC onboard storage.
- USB 3.0, USB 2.0 and dual-role USB for flexible peripheral connections.
- PCIe 3.0 (up to three lanes) for high-speed expansion.
- MIPI-CSI dual camera interface with ISP for vision processing.
Specifications
| Processor |
|
| Processor |
TI TDA4VM Arm® Application Processor |
| CPU |
2× ARM Cortex-A72 @ 2.0GHz, 6× ARM Cortex-R5F |
| AI Accelerator |
Deep-learning Matrix Multiply Accelerator (MMA), Up to 8 TOPS |
| Memory |
|
| DRAM |
4GB onboard LPDDR4 memory |
| eMMC |
32GB onboard eMMC |
| Networking |
|
| Ethernet |
2× Gigabit Ethernet with IEEE 1588 support |
| I/O Interfaces |
|
| USB |
1× Dual-role USB 2.0, 2× USB 2.0, 2× USB 3.0 |
| SDIO |
1× SDIO 3.0 |
| PCIe |
2× PCIe 3.0 ×1 + 1× PCIe 3.0 ×2, or Up to 3× PCIe 3.0 ×1 |
| I²C |
2× I²C |
| SPI |
2× SPI |
| UART |
4× UART (2× with Handshake) |
| CAN |
2× CAN FD |
| GPIO |
14× GPIO |
| Storage |
|
| Mass Storage |
eMMC 5.1 up to 128 GB |
| Graphics |
|
| GPU |
Integrated in SoC, PowerVR Rogue 8XE GE8430 3D Graphics Accelerator |
| Graphics Features |
Up to 1× Ultra-HD or 4× Full-HD 30fps display resolution, Up to 4 concurrent displays,
VPU up to 4Kp30 H.264/H.265 decode, 1080p60 H.264 encode, OpenGL ES 3.1, OpenVX, OpenCL
|
| Video Interfaces |
|
| Display Interfaces |
1× Dual-channel 24-bit LVDS, 1× DisplayPort up to 4Kp30, Optional 1× MIPI-DSI 4-lane shared with LVDS |
| Camera Interfaces |
2× MIPI-CSI, Integrated Image Signal Processor (ISP) for camera on TDA4VM |
| Audio |
|
| Audio |
2× I²S |
| Features |
|
| System Features |
Watchdog Timer, Console Port, High precision Real Time Clock |
| AI & Deep Learning |
|
| AI & Deep Learning |
Deep-learning Matrix Multiply Accelerator (MMA) with up to 8 TOPS (8b), C7x floating point vector DSP with up to 80
GFLOPs, Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist
accelerators, Depth and Motion Processing Accelerators (DMPAC)
|
| Software |
|
| Boot Loader |
U-Boot boot loader |
| Operating Systems |
Linux |
| Power |
|
| Power Consumption |
Typical application 5–10W @ 5V |
| Environmental |
|
| Operating Temperature |
-40°C to +85°C (Industrial
|
| Storage Temperature |
-40°C to +85°C |
| Operating Humidity |
10% to 85% RH, Non-condensing |
| Storage Humidity |
5% to 85% RH, Non-condensing |
| Mechanical |
|
| Form Factor |
SMARC Module |
| Dimensions |
82 × 50 mm (3.23 × 1.97 in) |
