Boost your server’s reliability and keep peak performance alive with the HPE DL325 G10+ V2 High Performance FIO CPU Heat Sink Kit Server Cooling. This precision‑engineered cooling solution stops overheating before it happens, protecting your investment and ensuring uninterrupted uptime.
HPE DL325 G10+ V2 High Performance FIO CPU Heat Sink Kit Server Cooling
Designed for 1U server environments, this kit combines aluminum and copper heat‑dissipation technology to move heat away from Gen10+ CPUs quickly and quietly. The passive design eliminates the need for extra power while delivering high‑performance thermal management across a 0°C‑70°C operating range.
Installation is straightforward: the kit aligns perfectly with HPE Gen10+ CPU sockets, and its lightweight construction (~1.35 kg) adds minimal load to your chassis. The sleek silver finish not only looks professional but also resists corrosion for long‑term durability.
Whether you run intensive workloads, virtualization, or data‑intensive applications, this heat sink kit maintains optimal CPU temperatures, extending component life and reducing the risk of thermal throttling.
Benefits
- Prevents CPU overheating, ensuring consistent server performance.
- Passive cooling eliminates additional power consumption and noise.
- Lightweight, compact design fits 1U server form factor without sacrificing efficiency.
- Durable aluminum and copper construction provides long‑term reliability.
Uses of the product
- Thermal management for HPE DL325 G10+ V2 servers in data centers.
- Maintaining stable temperatures during high‑load processing tasks.
- Supporting virtualization and cloud workloads that demand continuous uptime.
- Replacing or upgrading existing heat sinks in Gen10+ CPU sockets.
Features
- High‑performance active/passive heat dissipation optimized for 1U servers.
- Compatible with HPE Gen10+ CPU sockets, ensuring a perfect fit.
- Combination of aluminum and copper materials for superior thermal conductivity.
- Operating temperature range of 0°C to 70°C, suitable for most server environments.
| Specification |
Details |
| Brand |
HPE |
| Model |
DL325 G10+ V2 |
| Product Type |
CPU Heat Sink Kit |
| Category |
Heatsinks / Thermal Solutions |
| Form Factor |
1U / Server Optimized |
| Cooling Method |
Active / Passive Heat Dissipation (High Performance) |
| Material |
Aluminum / Copper (model dependent) |
| Operating Voltage |
Not Required (passive kit) |
| Operating Temperature |
0°C to 70°C |
| Color |
Silver / Metal |
| Socket Compatibility |
HPE Gen10+ CPU Sockets |
| Application |
Server CPU Thermal Management |
| Actual Weight |
~1.35 kg |
| Package Weight |
~1.6 kg |
