Elevate your server’s reliability and performance with the HPE ProLiant DL3X5 Gen11 CPU 1U Performance Heat Sink Kit Server Cooling. This precision‑engineered heat sink delivers superior thermal management, keeping your CPU cool even under heavy workloads, so you can maintain uptime and protect your investment.
HPE ProLiant DL3X5 Gen11 CPU 1U Performance Heat Sink Kit Server Cooling
Designed for 1U server environments, this kit combines high‑conductivity aluminum and copper to efficiently move heat away from the processor. It fits HPE Gen11 CPU sockets perfectly, ensuring a seamless match with your existing hardware without the need for additional power.
Installation is straightforward—simply attach the kit to the CPU and secure it with the provided hardware. No wiring or external fans are required, which reduces clutter and potential points of failure.
The heat sink operates reliably from 0 °C to 70 °C and weighs only about 1.2 kg, making it lightweight yet robust enough for demanding data‑center conditions.
Benefits
- Enhanced thermal performance keeps your CPU operating at optimal temperatures.
- Extends processor lifespan by preventing overheating.
- Passive cooling eliminates fan noise for a quieter server environment.
- Simple, tool‑free installation saves time and reduces deployment costs.
Uses of the product
- High‑density 1U rack servers in data centers.
- Compute‑intensive workloads such as AI and analytics.
- Virtualization hosts that require stable, low‑temperature operation.
- Edge computing appliances where space and power are limited.
Features
- 1U‑optimized aluminum and copper construction for maximum heat transfer.
- Passive heat dissipation design—no external power or fans needed.
- Fully compatible with HPE Gen11 CPU sockets for a perfect fit.
- Lightweight design (~1.2 kg) for easy handling and installation.
| Specification |
Details |
| Brand |
HPE |
| Model |
DL3X5 Gen11 |
| Product Type |
CPU Heat Sink Kit |
| Category |
Heatsinks / Thermal Solutions |
| Form Factor |
1U Server CPU |
| Cooling Method |
Active / Passive Heat Dissipation (1U optimized) |
| Material |
Aluminum / Copper (model dependent) |
| Operating Voltage |
Not required (passive kit) |
| Operating Temperature |
0°C to 70°C |
| Color |
Silver / Metal |
| Socket Compatibility |
HPE Gen11 CPU Sockets |
| Application |
Server CPU Thermal Management |
| Actual Weight |
~1.2 kg |
| Package Weight |
~1.5 kg |
