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IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit
IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit
IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit
IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit

IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Industrial PC


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Product Code: MNHO-364

MPN #: TANK-XM811AI-RPL01/2A-R10

Developing AI-enabled IoT devices often stalls because the hardware is too slow or lacks the right ports. When a prototype cannot keep up, testing takes longer and costs rise. The IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit gives you a fast processor, ample storage and many connections, so you can build and test edge AI projects without bottlenecks.

 

IEI TANK-XM811AI-RPL, Intel Core i9-13900TE, 256GB SSD AIoT Developer Kit with IEI

Turn ideas into real AIoT solutions in a single box. This kit packs a 24-core Intel Core i9-13900TE, 32 GB of DDR4 RAM and a 256 GB SSD, all inside a sturdy aluminum case. Developers who struggle with fragmented components finally get a complete platform that talks to sensors, cameras and industrial equipment. With IEIs proven reliability, you can focus on code instead of hardware headaches.

 

Key Features
    • Intel Core i9-13900TE, 24-core (8P+16E) processor, up to 5.0 GHz.
    • 256 GB SSD (option to upgrade to 512 GB in refresh model).
    • Dual 2.5 GbE Ethernet (Intel I226LM and I226-V) for high-speed networking.
    • 1 x DisplayPort++ and 1 HDMI, both supporting up to 4K@60 Hz.
    • 2 x PCIe x8 slots, total power up to 75 W, ready for expansion cards.
    • Two M.2 slots: one 2230 A-key (vPro) and one 2280 M-key (PCIe x4).
    • 12-bit digital I/O (6-in/6-out) for sensor and actuator control.
    • Wall-mountable aluminum chassis with fan cooling for rugged use.
    • Programmable watchdog timer (1-255 s) for reliable unattended operation.



Specifications
Form Factor
Color Black
Dimension (W x D x H) 137.9 x 255.4 x 230.6 mm
Fan/Fanless Fan
Chassis Construction Extruded aluminum alloys
Motherboard
CPU Intel® Core™ i9-13900TE 1.0GHz (up to 5.0GHz, 24-Core (8P+16E), TDP 35W)
Chipset Intel® R680E
System Memory 2 x SO-DIMM DDR4 3200MHz (2 x 16GB non-ECC Pre-installed, up to 64GB, support ECC SKU)
Storage
Hard Drive 13th(RPL): 1 x 2.5" HDD/SSD bay (256GB SSD pre-installed)
14th(RPL Refresh): 1 x 2.5" HDD/SSD bay (512GB SSD pre-installed)
I/O Interfaces
Ethernet 2 x RJ45:
1 x Intel I226LM 2.5GbE
1 x Intel I226-V 2.5GbE
(Note:Previous motherboard version is I225 LM/-V 2.5GbE)
USB 3.2 Gen 2 (10Gb/s) 8
COM 2 x RS-232/422/485
4 x RS-232
Digital I/O 12-bit (6-in/6-out)
Display 1 x DP++ (up to 4096 x 2160@60Hz)
1 x HDMI (up to 4096 x 2160@30Hz)
Expansion Slots
M.2 1 x 2230 A-key (PCIe x1/ USB2.0 support Intel® vPro)
1 x 2280 M-key (PCIe x4)
Backplane 2 x PCIe x8 slot (total power up to 75W, support FHHL card)
Power
Power Input DC Jack: 12V ~ 28V DC
Terminal Block: 12V ~ 28V DC
Remote Power Terminal Block: 2-Pin
Reliability
Mounting Wall mount
Operating Temperature -20°C ~ 60°C with air flow (with SSD), 10% ~ 95%, non-condensing
Storage Temperature -40°C ~ 80°C, 10% ~ 95%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis (with SSD)
Operation Vibration MIL-STD-810G 514.6C-1 (with SSD)
Weight (Net / Gross) 4.6kg / 5.6kg
Safety / EMC CE / FCC
Watchdog Timer Programmable 1 ~ 255 sec/min
OS
Supported OS Windows® 10 IoT Enterprise / Linux
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