Many industrial and edge-computing systems struggle when a low-power CPU cannot keep up with several applications, graphics, or high-speed I/O at once. The Intel Core i7-9850HE 9th Gen Processor (6 Cores, 9 MB Cache, 4.40 GHz) is a high-performance embedded CPU that delivers strong multi-core power while staying within a controlled power envelope, making it an ideal upgrade for demanding embedded platforms.
Intel Core i7-9850HE 9th Gen Processor
Embedded devices often need to run multiple workloads, visualise data and maintain real-time responsiveness. Without enough processing headroom, systems can become sluggish, miss deadlines or require larger, more power-hungry hardware. The i7-9850HE solves this by offering six cores and twelve threads, a base clock of 2.70 GHz that can boost to 4.40 GHz, and a 9 MB cache that keeps data close to the cores. Built on a 14 nm Coffee Lake architecture, it balances speed with efficiency, fitting neatly into compact, thermally constrained designs.
Key Features
- Six physical cores and twelve threads for parallel processing.
- Base frequency 2.70 GHz, with Intel Turbo Boost 2.0 reaching 4.40 GHz.
- 9 MB of smart cache to accelerate data access.
- 8 GT/s bus speed for fast communication with other components.
- 45 W default TDP, configurable down to 35 W for tighter power budgets.
- Dual-channel DDR4-2666 support, up to 64 GB total memory.
Specifications
| Product Information |
|
| Product Collection |
9th Generation Intel® Core™ i7 Processors |
| Code Name |
Products formerly Coffee Lake |
| Vertical Segment |
Embedded |
| Processor Number |
i7-9850HE |
| Lithography |
14 nm |
| Recommended Customer Price |
$395.00 |
| CPU Specifications |
|
| Total Cores |
6 |
| Total Threads |
12 |
| Max Turbo Frequency |
4.40 GHz |
| Intel® Turbo Boost Technology 2.0 Frequency |
4.40 GHz |
| Processor Base Frequency |
2.70 GHz |
| Cache |
9 MB |
| Bus Speed |
8 GT/s |
| TDP |
45 W |
| Configurable TDP-down |
35 W |
| Supplemental Information |
|
| Marketing Status |
Launched |
| Launch Date |
Q2'19 |
| Embedded Options Available |
Yes |
| Use Conditions |
Embedded Broad Market Commercial Temp |
| Datasheet |
View now |
| Memory Specifications |
|
| Max Memory Size (dependent on memory type) |
64 GB |
| Memory Types |
DDR4-2666 |
| Memory Channels |
2 |
| ECC Memory Supported |
No |
| GPU Specifications |
|
| GPU Name |
Intel® UHD Graphics 630 |
| Graphics Base Frequency |
350 MHz |
| Graphics Max Dynamic Frequency |
1.15 GHz |
| Graphics Video Max Memory |
64 GB |
| Graphics Output |
eDP/DP/HDMI/DVI |
| 4K Support |
Yes, at 60Hz |
| Max Resolution (HDMI) |
4096 x 2160@30Hz |
| Max Resolution (DP) |
4096 x 2304@60Hz |
| Max Resolution (eDP - Integrated Flat Panel) |
4096 x 2304@60Hz |
| Max Resolution (VGA) |
N/A |
| DirectX* Support |
12 |
| OpenGL* Support |
4.5 |
| Intel® Quick Sync Video |
Yes |
| Intel® InTru™ 3D Technology |
Yes |
| Intel® Clear Video HD Technology |
Yes |
| Intel® Clear Video Technology |
Yes |
| isplays Supported |
3 |
| Device ID |
0x3E9B |
| Expansion Options |
|
| Scalability |
1S Only |
| PCI Express Revision |
3.0 |
| PCI Express Configurations |
Up to 1x16, 2x8, 1x8+2x4 |
| Max # of PCI Express Lanes |
16 |
| Package Specifications |
|
| Sockets Supported |
FCBGA1440 |
| Max CPU Configuration |
1 |
| TJUNCTION |
100°C |
| Package Size |
42mm x 28mm |
