Imagine you could test a full-size car infotainment system in a lab without worrying about overheating or safety failures. The Lantronix ADP-8295PS-IVI-T is a Snapdragon-based automotive development platform built for engineers who need a reliable, high-performance base for IVI, ADAS and connected-car projects. Without a platform like this, you face long hardware delays, costly redesigns, and missed safety certifications. This board gives you everything you need to move from concept to prototype quickly.
Lantronix ADP-8295PS-IVI-T, SA8295PS Snapdragon Automotive Development Platform
Developers often struggle to find a single board that combines the raw compute power of Snapdragon with the safety features required for automotive standards. When the hardware cannot meet ISO 26262 or cannot stay cool in a vehicle cabin, projects stall and budgets blow. Lantronix solves this by delivering the SA8295PS SoC together with a dedicated safety manager, dual-ARC CPUs, and a thermal enclosure rated to 85 C. The result is a ready-to-use platform that meets performance, safety and temperature demands, letting you focus on software and system integration instead of hardware headaches.
Key Features
- Snapdragon SA8295PS SIP with Kryo 695 CPU and Adreno 695 GPU.
- Dedicated Safety Manager with dual ARC HS46 CPUs in lock-step.
- 16 GB 2133 MHz LPDDR4X SDRAM across eight channels.
- Two UFS 3.1 gear-4 storage lanes and optional NVMe PCIe.
- Four 4-lane MIPI CSI camera interfaces and two MIPI DSI display links.
- Three DisplayPort outputs, one shared with USB 3.1, plus four eDP v1.4b lanes.
- Wi-Fi 6 (802.11ax) and Bluetooth 5.2 dual-MAC with 1 774 Mbps combined PHY rate.
- 1 1000 Base-T1 and 2 100 Base-T1 Ethernet ports.
- 4 CAN-FD and 2 LIN interfaces for vehicle networking.
- Six Class-D analog audio outputs, four analog/MIC inputs, and two A2B links.
Specifications
| General |
|
| Product Name |
SA8295PS Snapdragon™ Automotive Development Platform with Thermal Enclosure Configuration |
| Part Number |
ADP-8295PS-IVI-T |
| Device Type |
Snapdragon™ Automotive Development Platform (ADP) |
| Configuration |
Thermal Enclosure Configuration |
| SoC Module |
QAM8295PS |
| Processor |
|
| Processor |
Snapdragon™ SA8295PS SIP |
| CPU |
Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology |
| GPU |
Qualcomm® Adreno™ 695 GPU |
| ISP |
Qualcomm® Spectra™ ISP 395 image processing engine |
| VPU |
Adreno 665 VPU |
| DPU |
Adreno DPU 1199 |
| Safety Manager |
Dedicated Safety Manager Subsystem equipped with dual ARC HS46 CPU in lock-step mode |
| Safety MCU |
|
| Safety MCU |
1× Aurix TC397XX |
| Memory |
|
| Memory |
Eight-channel high-speed memory – 2133 MHz LPDDR4X SDRAM with optional low-power features
(8 × 16-bit); 16 GB
|
| Storage |
|
| UFS |
Two UFS 3.1 gear 4 – 2 lanes for on-board memory (UFS0 as boot up device) |
| NVMe |
NVMe via PCIe (not-bootable) |
| Audio |
|
| Analog Output |
Six Class D Amplifier Analog OUT |
| Analog / MIC Inputs |
Four Analog/MIC Inputs |
| A2B |
Two A2B |
| Power |
|
| Power Supply |
6 V to 20 V DC, typical 12 V DC |
| Camera |
|
| Camera |
Four 4-lane MIPI CSI configurable in 4 + 4 + 4 + 4 or split 2s configuration |
| Display |
|
| DisplayPort |
Three DisplayPorts, one of them shared with USB 3.1 |
| Embedded DisplayPort |
Four 4-lane embedded DisplayPort v1.4b |
| MIPI DSI |
Two 4-lane MIPI DSI D-PHY v1.2 |
| Connectivity |
|
| Wi-Fi / Bluetooth |
Wi-Fi 6 (802.11ax) + Bluetooth 5.2 Dual MAC MIMO + MIMO (QCA6696) |
| Radio Configuration |
Dual-band dual-MAC radios for concurrent 2×2 MIMO 2.4 GHz + 2×2 MIMO 5 GHz operation |
| Maximum PHY Rate |
Combined simultaneous maximum PHY rate of 1774 Mbps |
| Ethernet |
1× 1000 BaseT1 |
| Ethernet |
2× 100 BaseT1 |
| I/O |
|
| CAN-FD |
4× CAN-FD |
| LIN |
2× LIN |
| Sensors |
|
| Gyroscope / Accelerometer |
ASM330LHH |
| Magnetometer |
AK09917D |
| Test and Debug |
|
| JTAG |
SoC, VIP |
| USB Debug |
UARTs |
| Test Automation |
Supported |
| Software |
|
| OS Support |
Linux Kernel v5.4, Yocto Project baseline 3.1 |
| Thermal Configuration |
|
| Mechanical Design |
Thermal ADP AIR mechanical design intended to operate up to 85°C |
| Software |
ADPs are shipped without pre-installed software |
