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Lantronix QAM8255P Ride 4.0 SX Automotive Development Platform
Lantronix QAM8255P Ride 4.0 SX Automotive Development Platform

Lantronix QAM8255P Ride 4.0 SX Automotive Development Platform

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Product Code: DBHO-097

MPN #: ADP-8255-R

Developing modern car electronics is hard. Engineers must handle many sensors, cameras, and safety rules while keeping power low. If the platform is not powerful enough, testing takes longer and bugs appear later. The Lantronix QAM8255P Ride 4.0 SX Automotive Development Platform solves these issues. It gives you a complete, ready-to-use board that matches the latest automotive standards, so you can focus on software instead of hardware.

 

Lantronix QAM8255P Ride 4.0 SX Automotive Development Platform with Lantronix

This board is a full-size reference design for Snapdragon automotive SoC. It packs a fast CPU, high-speed memory, and many I/O options. Developers who need to prototype infotainment, ADAS, or digital cockpit can start right away. Without this platform, you would have to design each circuit yourself, which costs time and money. Lantronix makes the process simple and reliable.

 

 

Key Features
    • Quad-core Qualcomm Kryo Gold Prime CPU for high performance.
    • Qualcomm Adreno 663 GPU for smooth graphics on multiple screens.
    • Hexagon Tensor Processor with HVX and HMX for AI acceleration.
    • Six channels of 3200 MHz LPDDR5 SDRAM (3 x 12 GB).
    • Two 128 GB UFS 3.1 drives and optional NVMe SSD slot.
    • Four DisplayPort outputs and two 4-lane MIPI-DSI links.
    • Four mini-Quad FAKRA camera connectors with Spectra 690 ISP.
    • Eight CAN-FD interfaces and two LIN ports for vehicle networking.
    • Three high-speed I2S audio channels and six line-out channels.
    • Safety Island subsystem with quad Cortex-R52 CPU for functional safety.



Specifications
General  
Product Ride SX 4.0
Power  
Input Voltage +6 VDC to +20 VDC
Typical Input Voltage +12 VDC typical
SoC  
SoC Snapdragon Automotive SoC - available with SA8255P 
Memory  
LPDDR5 3 × 12 GB
Storage  
UFS Storage Two 128 GB UFS 3.1
M.2 Storage M.2 PCIe slot for optional NVMe SSD
NOR Flash Octal SPI NOR
USB  
USB 3.1 Two USB 3.1 type A
USB 2.0 One USB 2.0 type A
PCIe  
PCIe Gen4 x2 One PCIe Gen4 x2
PCIe Gen4 x4 One PCIe Gen4 x4
Cameras / Video Input  
Camera Connectors Four mini-Quad FAKRA connect
Displays / Video Output  
Display Outputs Four DisplayPorts
Sensors  
Sensor Interface One sensor card: GenX connector
GNSS  
GNSS Qualcomm® SiRFStar™ Location V
Audio  
Standard I2S Seven standard I2S
High Speed I2S Three high speed I2S
Radio AM / FM / DAB
Line Out Six channel line out
Analog / Mic Inputs Four analog/mic inputs
A2B Two ADI A2B master nodes
Wired Networking  
RJ45 RJ45 port connected to Safety Island Subsystem
RJ45 RJ45 port connected to Vehicle Interface Processor (VIP)
RJ45 Two RJ45 ports connected to SoC's SGMII ports
CAN-FD Six CAN-FD: SoC
CAN-FD (Partial Networking) Two CAN-FD: SoC – Partial Networking
CAN-FD (VIP) Two CAN-FD: VIP – Partial Networking
LIN Two LIN - VIP
Wireless Networking  
Wi-Fi and Bluetooth Via add-on card
Test and Debug  
JTAG / SWD Supported
UART Supported
Test Automation Embedded ALPACA PSoC
Processor  
CPU Quad Qualcomm® Kryo™ Kryo Gold Prime Cores
GPU  
GPU Qualcomm® Adreno™ 663 GPU
DSP  
DSP Qualcomm® Hexagon™ Tensor Processor integrated with Qualcomm Hexagon DSP
HVX Quad Qualcomm Hexagon Vector eXtensions (HVX) processor
HMX Dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors
Safety Island (SAIL) Subsystem  
SAIL Dedicated Safety Island (SAIL) Subsystem equipped with quad Cortex-R52 CPU
Multimedia  
Display Processor Dual Adreno DPU1199
MIPI-DSI Two 4-lane MIPI-DSI
Display Interfaces Four embedded DisplayPort (eDP) / DisplayPort v1.4
Camera  
ISP Qualcomm Spectra 690 ISP
MIPI-CSI Four MIPI-CSI interfaces, configurable as D-PHY or C-PHY
Video  
VPU Adreno VPU 670 for high-quality, ultra HD video encode and decode
Decode Decode up to 4 × 4k60 or 4k240; AV1, HEVC, H.264, H.265, VP9, MPEG-2
Encode Encode up to 2 × 4k60 or 4k120; HEVC, H.264 and H.265
Memory  
Memory Architecture Six-channel high-speed memory - 3200 MHz LPDDR5 SDRAM (6 × 16-bit)
Flash  
UFS Via UFS: Two UFS 3.1
NOR Flash Via Octal-SPI/Quad-SPI: NOR flash (up to 166 MHz) as SAIL domain boot up device
NVMe Via PCIe: NVMe (non-bootable)
Peripherals  
USB Two USB 3.1 and one USB 2.0
PCIe One 2-lane and one 4-lane PCIe Gen4
CAN-FD Eight SAIL domain CAN-FD interfaces
SGMII Two SGMII 2.5 Gbps interfaces
RGMII One SAIL domain RGMII interface

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