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Terasic Comet A13 System on Module (SOM) and Evaluation Kit
Terasic Comet A13 System on Module (SOM) and Evaluation Kit
Terasic Comet A13 System on Module (SOM) and Evaluation Kit
Terasic Comet A13 System on Module (SOM) and Evaluation Kit

Terasic Comet A13 System on Module (SOM) and Evaluation Kit

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Product Code: DBHO-045

MPN #: Comet A13

Terasic Comet A13 System on Module (SOM) and Evaluation Kit

 

The Comet A13 SOM is a compact, production-qualified System-on-Module based on the Altera Agilex™ 5 SoC FPGA; designed with ease of use and system integration in mind for edge AI and embedded applications.

By combining the FPGA fabric with ARM Cortex-A76/A55 processor cores and LPDDR4 memory (up to 2667 MTs), this SOM enables efficient data processing, real-time control, and system-level integration within a single platform. Its compute orientated architecture supports both data-intensive workloads and deterministic processing making it suitable for latency-sensitive applications.

The Comet A13 provides four transceivers up to 17.16 Gbps and 191 high-voltage IO pins supporting 1.8V, 2.5V, and 3.3V interfaces, allowing direct connection to a wide range of sensors, cameras, and industrial peripherals without additional interface logic or drivers. The dual 300-pin SEAM8 connectors provide high-speed signals and IO resources which simplifies carrier board design and enabling flexible system expansion.

Designed for deployment, the Comet A13 SOM reduces FPGA hardware design complexity and accelerates time-to-market, making it well suited for building system-level applications such as machine vision systems, robotics platforms, industrial automation, and real-time data acquisition systems.

 

Key Features:

 

  • Processing System: Altera Agilex 5 E-Series SoC FPGA (A5ED013BB32AE4SCS) featuring FPGA fabric alongside Arm Cortex-A76 and Cortex-A55 cores. 
  • Memory: LPDDR4 memory onboard. 
  • Connectivity: 4 transceivers (up to 17.16 Gbps), 191 high-voltage I/O pins (supporting 1.8V, 2.5V, and 3.3V), and two 300-pin SEAM8 connectors. 

 

 

Specifications:
System  
FPGA A5ED013BB32AE4SCS (Agilex 5 E-Series Device Group B)
Module Size 60mm × 55mm
HVIO 191 HVIO (3.3V ×16, 1.8/2.5/3.3V ×175)
HSIO 72 HSIO (up to 12 LVDS RX and 24 LVDS TX/RX)
HPS IO 48 HPS IO
Transceivers 4 Transceivers
Interface Two SEAM8 Connectors (6×50 pin)
FPGA Side  
Clock Fixed 50 /100MHz Clock
Memory LPDDR4-B: 1GB DDR4 with 16-bit data bus (no ECC)
FPGA I/O 191-pin HVIO and 72-pin HSIO connected to SEAM8 connector
Transceivers 4 transceiver and 1 reference clock connected to SEAM8 connectors
HPS Side  
Memory LPDDR4-A: 4GB DDR4 with 32-bit data bus (no ECC). Shared with FPGA
HPS I/O 48 HPS IO connected to SEAM8 connector
Storage 8GB eMMC (Expandable) + eMMC SEL Switch
Carrier Board Features  
Power Input 12V DC Jack
Interface Two SEAF8 Connectors (6×50 pin)
FPGA Features LED ×1, SWITCH ×2, Button ×1
HDMI HDMI Out (1080P)
Camera Interface 22-pin Connector (4 Data Lane) for CSI2 Camera
GPIO Header One 3.3V 2×20 DE-GPIO Header
HPS Features MicroSD Socket
UART UART Port (Type-C Connector for Linux Terminal)
Ethernet Gigabit Ethernet PHY + RJ45
Reset HPS Cold Reset Button
Indicators LED ×2, Button ×1

 

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